HEXACHLORODISILANE

HEXACHLORODISILANE Basic information
Product Name:HEXACHLORODISILANE
Synonyms:1,1,1,2,2,2-Hexachlorodisilane;Disilane, hexachloro-;hexachloro-disilan;Si2Cl6;HEXACHLORODISILANE;Hexachlorodisilane (HCDS);Hexachlordisilan;HEXACHLORODISILANE, 99.9%
CAS:13465-77-5
MF:Cl6Si2
MW:268.89
EINECS:236-704-1
Product Categories:Chlorosilanes, oligosilanes;Si (Classes of Silicon Compounds);Si-Cl Compounds;Si-Si Compounds;Trichlorosilanes;Self Assembly&Contact Printing;Self-Assembly Materials;Silane Coupling Agents/Adhesion Promoters;SilanesSelf Assembly&Contact Printing
Mol File:13465-77-5.mol
HEXACHLORODISILANE Structure
HEXACHLORODISILANE Chemical Properties
Melting point <0°C
Boiling point 144-145.5 °C (lit.)
density 1.562 g/mL at 25 °C (lit.)
vapor pressure 2.8hPa at 25℃
refractive index n20/D 1.475(lit.)
Fp 78°C
storage temp. below 5° C
solubility sol CHCl3, CH2Cl2, benzene, THF; reacts violently, producing toxic fumes, with H2O, alcohols.
form liquid
Specific Gravity1.562
color Colorless to Almost colorless
Hydrolytic Sensitivity8: reacts rapidly with moisture, water, protic solvents
Stability:Stable, but reacts violently with water. Moisture sensitive. May be shock sensitive. Incompatible with water, moisture, acids, strong bases, oxidizing agents, alcohols.
CAS DataBase Reference13465-77-5(CAS DataBase Reference)
EPA Substance Registry SystemDisilane, hexachloro- (13465-77-5)
Safety Information
Hazard Codes C
Risk Statements 14-34
Safety Statements 26-36/37/39-45
RIDADR UN 2987 8/PG 2
WGK Germany 3
3-10-21
TSCA Yes
HazardClass 8
PackingGroup II
HS Code 28121049
MSDS Information
ProviderLanguage
ACROS English
SigmaAldrich English
HEXACHLORODISILANE Usage And Synthesis
Chemical Propertiescolourless liquid
Physical propertiesbp 144–145.5 °C; d 1.562 g cm?3.
UsesHexachlorodisilane can be used in deoxygenation and desulfurization of phosphine oxides, phosphine sulfides, and amine oxides; reducing agent for nitro groups and sulfur diimides.
UsesHCDS may be used as a reducing agent. It may be combined with ammonia to form silicon nitride by chemical vapor deposition(CVD) technique.
General DescriptionHexachlorodisilane (HCDS) is a chlorosilane used as a precursor for producing disilanes. It is a dioxidizer that is used in the production of silicon films and silicon nitride based films.
Flammability and ExplosibilityNonflammable
HEXACHLORODISILANE Preparation Products And Raw materials
Raw materialsHEXACHLORODISILOXANE
Preparation ProductsHexakis(ethylamino)disilane (99.995%-Si) PURATREM
HEXAPHENYLDISILANE Trimethyl phosphate Hydrogen fluoride DISILANE Trichlorosilane HEXACHLORODISILANE pentachlorodisilane

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