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| HEXACHLORODISILANE Basic information |
| HEXACHLORODISILANE Chemical Properties |
Melting point | <0°C | Boiling point | 144-145.5 °C (lit.) | density | 1.562 g/mL at 25 °C (lit.) | vapor pressure | 2.8hPa at 25℃ | refractive index | n20/D 1.475(lit.) | Fp | 78°C | storage temp. | below 5° C | solubility | sol CHCl3, CH2Cl2, benzene, THF; reacts violently,
producing toxic fumes, with H2O, alcohols. | form | liquid | Specific Gravity | 1.562 | color | Colorless to Almost colorless | Hydrolytic Sensitivity | 8: reacts rapidly with moisture, water, protic solvents | Stability: | Stable, but reacts violently with water. Moisture sensitive. May be shock sensitive. Incompatible with water, moisture, acids, strong bases, oxidizing agents, alcohols. | CAS DataBase Reference | 13465-77-5(CAS DataBase Reference) | EPA Substance Registry System | Disilane, hexachloro- (13465-77-5) |
Hazard Codes | C | Risk Statements | 14-34 | Safety Statements | 26-36/37/39-45 | RIDADR | UN 2987 8/PG 2 | WGK Germany | 3 | F | 3-10-21 | TSCA | Yes | HazardClass | 8 | PackingGroup | II | HS Code | 28121049 |
| HEXACHLORODISILANE Usage And Synthesis |
Chemical Properties | colourless liquid | Physical properties | bp 144–145.5 °C; d 1.562 g cm?3. | Uses | Hexachlorodisilane can be used in deoxygenation and desulfurization of phosphine oxides, phosphine
sulfides, and amine oxides; reducing agent for nitro groups
and sulfur diimides. | Uses | HCDS may be used as a reducing agent. It may be combined with ammonia to form silicon nitride by chemical vapor deposition(CVD) technique. | General Description | Hexachlorodisilane (HCDS) is a chlorosilane used as a precursor for producing disilanes. It is a dioxidizer that is used in the production of silicon films and silicon nitride based films. | Flammability and Explosibility | Nonflammable |
| HEXACHLORODISILANE Preparation Products And Raw materials |
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